Document Type

Conference Paper

Publication Date

2026

DOI

10.1088/1757-899X/1345/1/012024

Publication Title

IOP Conference Series: Materials Science and Engineering

Volume

1345

Pages

012024 (14 pp.)

Conference Name

International Cryogenic Materials Conference (ICMC) 2025, 18-22 May 2025, Reno, Nevada

Abstract

In support of the development of conduction-cooled superconducting radiofrequency (SRF) niobium cavities for use in continuous-wave linear accelerators, an experimental study of thermal contact resistance was performed on bolted joints using high-purity niobium, aluminium, and copper along with Apiezon N grease and indium foil as interfacial materials. The geometry of each joint investigated aims at replicating the design adopted in conduction-cooled SRF cavities currently under development at Jefferson Lab. The materials' thermal conductivity and the joints' thermal resistance were measured in the temperature range of 3.5 - 10 K. The results showed that the low thermal contact resistance of 2-4 K·cm²/W at 4.3 K achieved with Al-In-Nb and Al-Apiezon N-Cu joints should allow the operation of conduction-cooled SRF cavities at a targeted accelerating gradient of ∼10 MV/m.

Rights

© 2026 The Authors.

Content from this work may be used under the terms of the Creative Commons Attribution 4.0 International (CC BY 4.0) License. Any further distribution of this work must maintain attribution to the authors and the title of the work, journal citation and DOI.

Original Publication Citation

Lewis, J., & Ciovati, G. (2026). Development of thermal joints for conduction-cooling applications. IOP Conference Series: Materials Science and Engineering, 1345, Article 012024. https://doi.org/10.1088/1757-899X/1345/1/012024

ORCID

0000-0001-9316-7704 (Ciovati)

Share

COinS