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Temporary Bonding with Polydimethylglutarimide Based Lift Off Resist as a Layer Transfer Platform, T. Matsumae, A. D. Koehler, J. D. Greenlee, T. J. Anderson, H. Baumgart, G. G. Jernigan, K. D. Hobart, F. J. Kub Electrical & Computer Engineering Faculty Publications
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