Date of Award
Spring 2011
Document Type
Thesis
Degree Name
Master of Science (MS)
Department
Mechanical & Aerospace Engineering
Program/Concentration
Aerospace Engineering
Committee Director
Ali Beskok
Committee Member
Shizhi Qian
Committee Member
Yan Peng
Call Number for Print
Special Collections; LD4331.E535 S55 2011
Abstract
Heat conduction between two parallel solid walls separated by liquid argon is investigated using three-dimensional molecular dynamics (MD) simulations. Liquid argon molecules confined in silver and graphite nano-channels are examined separately. Heat flux and temperature distribution within the nano-channels are calculated by maintaining a fixed temperature difference between the two solid surfaces. Temperature profiles are linear sufficiently away from the walls, and heat transfer in liquid argon obeys the Fourier law. The temperature jump due to the interface thermal resistance (i.e., Kapitza length) is calculated by extrapolating the temperature profile in the bulk region on to the wall and is characterized as a function of the wall temperature. MD results enabled development of a phenomenological model for the Kapitza length, which is utilized as the coefficient of a Navier-type temperature jump boundary condition using a continuum heat conduction equation. Analytical solution of this model results in successful predictions of temperature distribution in liquid argon confined in silver and graphite nano-channels as thin as 7 nm and 3.57 nm, respectively.
Rights
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DOI
10.25777/fkjw-3b35
Recommended Citation
Shi, Ziyuan.
"Interface Thermal Resistance Between Liquid Argon and Various Solids"
(2011). Master of Science (MS), Thesis, Mechanical & Aerospace Engineering, Old Dominion University, DOI: 10.25777/fkjw-3b35
https://digitalcommons.odu.edu/mae_etds/695