16 - Redesigning Electronics Enclosure for WAM-V
Description/Abstract/Artist Statement
As an innovation in autonomous surface marine exploration, the Wave Adaptive Modular Vessel, or the WAM-V, is utilized for open-water research. Thus, it is crucial to design an equally innovative electronics box as the brain of this surface vessel. Design parameters include versatile mounting options, adequate ventilation while maintaining an IP65 seal, modular mounting options for electronics, and a unique and compelling box geometry. The mounting methodology of the box on the WAM-V will require solutions for both on and below the platform, using both brackets and pipe clamps. The final electronics box design included a grill-shaped lid and standing module panels for vertically mounted electronics. Manufacturing methodologies used include sheet metal fabrication, welding, 3D-Printing, and rapid prototyping.
Faculty Advisor/Mentor
Yiannis Papelis, Krishnanand Kaipa
Faculty Advisor/Mentor Department
Electrical and Computer Engineering, Mechanical and Aerospace Engineering
College Affiliation
College of Engineering & Technology (Batten)
Presentation Type
Oral Presentation
Disciplines
Computer-Aided Engineering and Design | Electro-Mechanical Systems | Manufacturing
16 - Redesigning Electronics Enclosure for WAM-V
As an innovation in autonomous surface marine exploration, the Wave Adaptive Modular Vessel, or the WAM-V, is utilized for open-water research. Thus, it is crucial to design an equally innovative electronics box as the brain of this surface vessel. Design parameters include versatile mounting options, adequate ventilation while maintaining an IP65 seal, modular mounting options for electronics, and a unique and compelling box geometry. The mounting methodology of the box on the WAM-V will require solutions for both on and below the platform, using both brackets and pipe clamps. The final electronics box design included a grill-shaped lid and standing module panels for vertically mounted electronics. Manufacturing methodologies used include sheet metal fabrication, welding, 3D-Printing, and rapid prototyping.