Document Type
Article
Publication Date
2020
DOI
10.1038/s41467-020-17822-0
Publication Title
Nature Communications
Volume
11
Pages
1-8
Abstract
Whether the presence of adsorbates increases or decreases thermal conductivity in metal-organic frameworks (MOFs) has been an open question. Here we report observations of thermal transport in the metal-organic framework HKUST-1 in the presence of various liquid adsorbates: water, methanol, and ethanol. Experimental thermoreflectance measurements were performed on single crystals and thin films, and theoretical predictions were made using molecular dynamics simulations. We find that the thermal conductivity of HKUST-1 decreases by 40 – 80% depending on the adsorbate, a result that cannot be explained by effective medium approximations. Our findings demonstrate that adsorbates introduce additional phonon scattering in HKUST-1, which particularly shortens the lifetimes of low-frequency phonon modes. As a result, the system thermal conductivity is lowered to a greater extent than the increase expected by the creation of additional heat transfer channels. Finally, we show that thermal diffusivity is even more greatly reduced than thermal conductivity by adsorption.
Original Publication Citation
Babaei, H., DeCoster, M. E., Jeong, M., Hassan, Z. M., Islamoglu, T., Baumgart, H., McGaughey, A. J., Redel, E., Farha, O. K., & Hopkins, P. E. (2020). Observation of reduced thermal conductivity in a metal-organic framework due to the presence of adsorbates. Nature Communications, 11, 1-8, Article 4010. https://doi.org/10.1038/s41467-020-17822-0
Repository Citation
Babaei, Hasan; DeCoster, Mallory E.; Jeong, Minyoung; Hassan, Zeinab M.; Islamoglu, Timur; Baumgart, Helmut; McGaughey, Alan J.H.; Redel, Engelbert; Farha, Omar K.; Hopkins, Patrick E.; Malen, Jonathan A.; and Wilmer, Christopher E., "Observation of Reduced Thermal Conductivity in a Metal-Organic Framework Due to the Presence of Adsorbates" (2020). Electrical & Computer Engineering Faculty Publications. 266.
https://digitalcommons.odu.edu/ece_fac_pubs/266
Included in
Electrical and Computer Engineering Commons, Materials Chemistry Commons, Materials Science and Engineering Commons
Comments
This article is licensed under a Creative Commons Attribution 4.0 International License, which permits use, sharing, adaptation, distribution and reproduction in any medium or format, as long as you give appropriate credit to the original author(s) and the source, provide a link to the Creative Commons license, and indicate if changes were made.