Document Type

Conference Paper

Publication Date

2023

DOI

10.18260/1-2--43146

Publication Title

2023 ASEE Annual Conference & Exposition

Pages

10 pp.

Conference Name

2023 ASEE Annual Conference & Exposition, 25-28 June 2023, Baltimore, Maryland

Abstract

Printed circuit boards (PCBs) are the foundational building blocks of most modern electronic devices. PCB assembly is defined as the process of mounting different electronic components on a PCB. Circuit board assembly utilizes an automated technique with most steps completed by machines for different operations (e.g., pick-and-place components, soldering, etc.). In this paper, details of a student course project, carried out at Old Dominion University, on the design and simulation of PCB assembly processes based on MATLAB discrete-event system are presented. An essential component in the advanced manufacturing technology course is the hands-on experience where students implement multiple software simulation tools including SimEvents, Simulink, and MATLAB for a manufacturing scenario. Students learned the principles of the discrete-event system and how to create a discrete-event simulation model to simulate the passing of entities through a network of queues, servers, gates, and switches based on events to describe flexible manufacturing systems. The proposed SimEvents model consists of five subsystems, which are used to represent a machine for solder printing, two machines for picking and placing electronic components, a machine for reflow soldering, and a machine for X-ray inspection. The simulation processes help the students understand the manufacturing processes of PCB and how productivity can be affected by visualizing the number of parts in queue and number of parts completed in each subsystem with different setups and parameters.

Rights

© 2023 American Society for Engineering Education, ASEE Annual Conference Proceedings (Baltimore, Maryland, June 25-28, 2023)

"ASEE holds the copyright on this document. It may be read by the public free of charge. Authors may archive their work on personal websites or in institutional repositories with the following citation: © 2023 American Society for Engineering Education. Other scholars may excerpt or quote from these materials with the same citation. When excerpting or quoting from Conference Proceedings, authors should, in addition to noting the ASEE copyright, list all the original authors and their institutions and name the host city of the conference. - Last updated April 1, 2015"

Original Publication Citation

Dong, S., Tomovic, M., & Kaipa, K. (2023) Development of a SimEvents model for printed circuit board (PCB) assembly processes [Paper presentation]. 2023 ASEE Annual Conference & Exposition, Baltimore, Maryland. https://doi.org/10.18260/1-2--43146

ORCID

0000-0002-8095-938X (Kaipa)

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