Document Type

Conference Paper

Publication Date

2014

Publication Title

2014 ASEE Annual Conference Proceedings

Pages

1-17 (24.122)

Conference Name

2014 ASEE Annual Conference and Exposition, Indianapolis, Indiana, June 15-18, 2014

Abstract

Faculty from the Electrical Engineering and Design Engineering Technology Departments at Trine University have developed a joint design module for upper-level courses in their respective disciplines. In this module, student teams collaborate in designing and prototyping the electronics and packaging for a hand-held sensor system. The principal objective of the collaboration is for students to incorporate design factors external to their discipline in a program-focused design project. This effort advances the students' abilities to work effectively in multidisciplinary teams during their senior capstone courses. The design module was introduced in the fall 2011 semester, and was repeated in fall 2012 and fall 2013. An assessment, conducted with current and former participants in fall 2013, demonstrates the efficacy of the project.

Comments

© 2014 American Society for Engineering Education, ASEE Annual Conference Proceedings, Indianapolis, Indiana, June 15-18, 2014.

Original Publication Citation

Thomas, M. B., Mitofsky, A., Jovanovic, V., & Eiler, J. (2014). A third-year review of design and packaging of sensor systems. Paper presented at the 2014 ASEE Annual Conference and Exposition, Indianapolis, Indiana.

ORCID

0000-0002-8626-903X (Jovanovic)

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