Document Type
Conference Paper
Publication Date
2015
Publication Title
Proceedings of the 6th International Particle Accelerator Conference
Pages
3581-3583
Conference Name
6th International Particle Accelerator Conference (IPAC 2015)
Abstract
The inner surfaces of SRF cavities are currently chemically treated (etched or electro polished) to achieve the state of the art RF performance. We designed an apparatus and developed a method for plasma etching of the inner surface for SRF cavities. The process parameters (pressure, power, gas concentration, diameter and shape of the inner electrode, temperature and positive dc bias at inner electrode) are optimized for cylindrical geometry. The etch rate non-uniformity has been overcome by simultaneous translation of the gas point-of-entry and the inner electrode during the processing. A single cell SRF cavity has been centrifugally barrel polished, chemically etched and RF tested to establish a baseline performance. This cavity is plasma etched and RF tested afterwards. The effect of plasma etching on the RF performance of this cavity will be presented and discussed.
Original Publication Citation
Upadhyay, J., Im, D., Peshl, J., Vuskovic, L., Popovic, S., Valente, A.-M., & Phillips, H. L. (2015). Experiment and Results on Plasma Etching of SRF cavities. In Proceedings of the 6th International Particle Accelerator Conference, Richmond, VA, May 3-8, 2015 (pp. 3581-3583). http://accelconf.web.cern.ch/AccelConf/IPAC2015/papers/wepwi040.pdf
ORCID
0000-0003-1364-0579 (Upadhyay), 0000-0002-3668-4841 (Popovic), 0000-0002-7202-7283 (Vuskovic)
Repository Citation
Upadhyay, J.; Im, Do; Peshl, J.; Popovic, S.; Vuskovic, L.; Valente-Feliciano, A. -M.; and Phillips, L., "Experiment and Results on Plasma Etching of SRF Cavities" (2015). Physics Faculty Publications. 277.
https://digitalcommons.odu.edu/physics_fac_pubs/277
Comments
This work is supported by the Office of High Energy Physics, Office of Science, Department of Energy under Grant No. DE-SC0007879
Copyright © 2015 by JACoW, Geneva, Switzerland.
Published under a Creative Commons Attribution 3.0 unported license.
https://creativecommons.org/licenses/by/3.0/