Document Type
Conference Paper
Publication Date
2018
DOI
10.18429/JACoW-LINAC2018-TUPO031
Publication Title
Proceedings of the 29th Linear Accelerator Conference
Pages
395-397
Abstract
The Center for Accelerator Science at Old Dominion University has built a half-wave coaxial cavity (*) to measure the surface resistance of niobium as a function of frequency, temperature, rf field, preparation techniques, over a wide range of frequencies of interest for particle accelerators. The characteristics of the half-wave coaxial cavity provide these information on a same surface. The preliminary results showed clearly the frequency dependence of residual surface resistance (**). After establishing baseline, we have conducted a study of low temperature baking effect on the surface resistance under controlled environment. This paper will describe the details of the test procedure, results and we will explore underlying physics of the phenomenon.
* H. Park et al., MOPB003, Proc. SRF2015, http://jacow.org/
** H. Park et al., THPB080, Proc. SRF2017, http://jacow.org/
Original Publication Citation
Park, H., Delayen, J. R., & De Silva, S. U. (2018). Investigation of the surface resistance of niobium between 325 and 1300 MHz using a coaxial half-wave cavity. In G. Pei, V.R.W. Schaa, Y.H. Chin, S. Fu, & N. Zhao (Eds.) Proceedings of the 29th Linear Accelerator Conference (pp. 395-397). Joint Accelerator Conferences Website. https://doi.org/10.18429/JACoW-LINAC2018-TUPO031
ORCID
0000-0002-4809-9439 (De Silva)
Repository Citation
Park, Hyekyoung; Delayen, Jean R.; and De Silva, Subashini, "Investigation of the Surface Resistance of Niobium Between 325 MHz and 1300 MHz Using a Coaxial Half-wave Cavity" (2018). Physics Faculty Publications. 666.
https://digitalcommons.odu.edu/physics_fac_pubs/666
Comments
Published by JACoW Publishing under the terms of the Creative Commons Attribution 3.0 Unported (CC BY 3.0) license. Any further distribution of this work must maintain attribution to the authors, the published article's title, publisher, and DOI.